Metal-organic framework (MOF) thin films could be used for ion/molecular sieving, sensing, catalysis, and energy storage, but thus far no large-scale applications are known. One of the reasons is the lack of convenient and controllable fabrication methods. This work reviews the cathodic deposition of MOF films, which has advantages (e.g., simple op...
status: published
Zinc coatings on Cu substrates were successfully electroplated from choline chloride (ChCl) with ethylene glycol (EG) based deep eutectic solvent with the current density varied from 10 to 40 mA cm(-2) in air atmosphere at a temperature of 343 K. The effects of current density on the microstructure and corrosion performance were investigated in thi...
Zinc coatings on Cu substrates were successfully electroplated from choline chloride (ChCl) with ethylene glycol (EG) based deep eutectic solvent with the current density varied from 10 to 40 mA cm(-2) in air atmosphere at a temperature of 343 K. The effects of current density on the microstructure and corrosion performance were investigated in thi...
status: published
In this work, a nano-polycrystalline Ag-doped ZnO-based threshold switching (TS) selector via a facile co-sputtering technique is investigated without using an Ag active metal layer. The effects of the Ag concentration with respect to OFF-state leakage current (I-off) were studied, and the results demonstrate that by regulating the Ag doping concen...
Programmable memory characteristics of electrodeposited CuOx-based resistive random access memory (ReRAM) can be significantly improved by adopting a bilayer structure with a built-in current limiter. To control the on-current and enhance the device uniformity, the bilayer structure of Pt/CuOx (switching layer)/CuOx (current limiter)/Pt is proposed...
A promising alternative route for the synthesis of three-dimensional Au dendrites was developed by direct electrodeposition from a solution of HAuCl4 containing 3-aminopropyltriethoxysilane (APTS). Ultraviolet-visible spectroscopy, fourier transform infrared spectroscopy and isothermal titration calorimetry were used to study the interaction of APT...
The bottom-up approach using self-assembled materials/processes is thought to be a promising solution for next-generation device fabrication, but it is often found to be not feasible for use in real device fabrication. Here, we report a feasible and versatile way to fabricate high-density, nanoscale memory devices by direct bottom-up filling of mem...
