Mitra, Joydeep Torres, Andres Ma, Yuansheng Pan, David Z.
Published in
Journal of Micro/Nanolithography, MEMS, and MOEMS
Directed self-assembly (DSA) has emerged as one of the most compelling next-generation patterning techniques for sub 7 nm via or contact layers. A key issue in enabling DSA as a mainstream patterning technique is the generation of grapho-epitaxy-based guiding pattern (GP) shapes to assemble the contact patterns on target with high fidelity and reso...
Jackson, Nathan Olszewski, Oskar Z. O’Murchu, Cian Mathewson, Alan
Published in
Journal of Micro/Nanolithography, MEMS, and MOEMS
Developing a self-sustained leadless pacemaker requires the development of an ultralow-frequency energy harvesting system that can fit within the required dimensions. This paper reports on the design and development of two types of PiezoMEMS energy harvesters that fit within the capsule dimensions and have a low resonant frequency between 20 to 30 ...
Wang, Jingyu Wilkinson, William
Published in
Journal of Micro/Nanolithography, MEMS, and MOEMS
Accurate characterization of image rippling is critical in early detection of back-end-of-line (BEOL) patterning weakpoints, as most defects are strongly associated with excessive rippling that does not get effectively compensated by optical proximity correction (OPC). We correlate image contour with design shapes to account for design geometry-dep...
Ganji, Bahram Azizollah Sedaghat, Sedighe Babaei Roncaglia, Alberto Belsito, Luca Ansari, Reza
Published in
Journal of Micro/Nanolithography, MEMS, and MOEMS
This paper presents design, modeling, and fabrication of a crab-shape microphone using silicon-on-isolator (SOI) wafer. SOI wafer is used to prevent the additional deposition of sacrificial and diaphragm layers. The holes have been made on diaphragm to prevent back plate etching. Dry etching is used for removing the sacrificial layer, because wet e...
Jeong, Moongyu Hahn, Jae W.
Published in
Journal of Micro/Nanolithography, MEMS, and MOEMS
Circuit design is driven to the physical limit, and thus patterns on a wafer suffer from serious distortion due to the optical proximity effect. Advanced computational methods have been recommended for photomask optimization to solve this problem. However, this entails extremely high computational costs leading to problems including lengthy run tim...
Jindal, Sumit Kumar Mahajan, Ankush Raghuwanshi, Sanjeev Kumar
Published in
Journal of Micro/Nanolithography, MEMS, and MOEMS
An analytical model and numerical simulation for the performance of MEMS capacitive pressure sensors in both normal and touch modes is required for expected behavior of the sensor prior to their fabrication. Obtaining such information should be based on a complete analysis of performance parameters such as deflection of diaphragm, change of capacit...
Henn, Mark-Alexander Barnes, Bryan M. Zhou, Hui
Published in
Journal of Micro/Nanolithography, MEMS, and MOEMS
Optical three-dimensional (3-D) nanostructure metrology utilizes a model-based metrology approach to determine critical dimensions (CDs) that are well below the inspection wavelength. Our project at the National Institute of Standards and Technology is evaluating how to attain key CD and shape parameters from engineered in-die capable metrology tar...
Mack, Chris
Published in
Journal of Micro/Nanolithography, MEMS, and MOEMS
Editor-in-Chief Chris Mack explains what motivates scientists to write and publish research.
Endo, Akira Smrž, Martin Mužík, Jiří Novák, Ondřej Chyla, Michal Mocek, Tomáš
Published in
Journal of Micro/Nanolithography, MEMS, and MOEMS
The technology for extreme ultraviolet (EUV) lithography sources is maturing. Laser produced plasma (LPP) sources with usable power >100 W have been used in high-volume manufacturing (HVM) applications, and 250-W sources are expected to be introduced in HVM soon. However, a further increase of power and cleanness may benefit a powerful picosecond (...
Sherwin, Stuart Neureuther, Andrew Naulleau, Patrick
Published in
Journal of Micro/Nanolithography, MEMS, and MOEMS
Achieving high-throughput extreme ultraviolet (EUV) patterning remains a major challenge due to low source power; phase-shift masks can help solve this challenge for dense features near the resolution limit by creating brighter images than traditional absorber masks when illuminated with the same source power. We explore applications of etched mult...
