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Titrimetric Determination of Tin(II, IV) in Electrolytes Used in Electroplating for the Deposition of Sn, Cu–Sn, and Ni–Sn Coatings

Authors
  • Kudaka, A. A.1
  • Galuza, M. G.2
  • Vorobyova, T. N.1, 2
  • 1 Faculty of Chemistry, Belarusian State University, Minsk, 220006, Republic of Belarus , Minsk (Belarus)
  • 2 Research Institute of Physical and Chemical Problems, Belarusian State University, Minsk, 220006, Republic of Belarus , Minsk (Belarus)
Type
Published Article
Journal
Journal of Analytical Chemistry
Publisher
Pleiades Publishing
Publication Date
Jul 03, 2021
Volume
76
Issue
7
Pages
898–905
Identifiers
DOI: 10.1134/S106193482107008X
Source
Springer Nature
Keywords
Disciplines
  • Articles
License
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Abstract

AbstractA procedure is developed for the separate determination of the Sn(II) and Sn(IV) in the range of 0.05–0.25 M in acidic aqueous and ethylene glycol solutions in the presence of Ni(II), Cu(II), F–, a surfactant (OS-20), and citric or oxalic acids. The direct iodatometric titration of Sn(II) is used before and after the reduction of Sn(IV) with aluminum. The procedure is applicable to the analysis of electrolytes for the deposition of tin and Ni–Sn and Cu–Sn alloys and can be used to monitor changes in the concentrations of Sn(II and IV) as a result of redox processes in electrolytes and the hydrolysis of tin compounds. The interfering effect of copper consists in the interaction of Cu(II) with Sn(II) and Al with the formation of Cu(I) ions, reacting with iodate ions, and is eliminated by the introduction of oxalic acid. The relative error in determining the concentration of tin in the absence of copper(II) ions and in the presence of other components does not exceed 2.2%, and in the presence of Cu(II) the error is 4.3%.

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