Affordable Access

deepdyve-link deepdyve-link
Publisher Website

Thermal properties of graphene-copper-graphene heterogeneous films.

Authors
Type
Published Article
Journal
Nano Letters
1530-6992
Publisher
American Chemical Society
Publication Date
Volume
14
Issue
3
Pages
1497–1503
Identifiers
DOI: 10.1021/nl404719n
PMID: 24555640
Source
Medline
License
Unknown

Abstract

We demonstrated experimentally that graphene-Cu-graphene heterogeneous films reveal strongly enhanced thermal conductivity as compared to the reference Cu and annealed Cu films. Chemical vapor deposition of a single atomic plane of graphene on both sides of 9 μm thick Cu films increases their thermal conductivity by up to 24% near room temperature. Interestingly, the observed improvement of thermal properties of graphene-Cu-graphene heterofilms results primarily from the changes in Cu morphology during graphene deposition rather than from graphene's action as an additional heat conducting channel. Enhancement of thermal properties of graphene-capped Cu films is important for thermal management of advanced electronic chips and proposed applications of graphene in the hybrid graphene-Cu interconnect hierarchies.

Statistics

Seen <100 times