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Stress wave attenuation in ceramic plates

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DSpace at IIT Bombay
Keywords
  • Ultrasonic-Attenuation
  • Grain-Boundaries
  • Elastic-Modulus
  • Armor
  • Size
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Abstract

Studies on planar longitudinal stress wave attenuation in thin ceramic plates are presented using a wave tracking algorithm. The results are also experimentally validated. Ceramic plates consist of grains and grain boundaries. Elastic modulus and density of the grain boundaries are less than those of the grains. When the planar longitudinal stress wave encounters an interface between the grain and the grain boundary, reflection and transmission of the incident stress wave take place because of the impedance mismatch at the interface. It is observed that this leads to attenuation in stress wave intensity. This behavior is represented by stress wave attenuation coefficient. It is observed that the stress wave attenuation coefficient is a material property. (C) 2008

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