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State of the art on gate insulation and surface passivation for GaN-based power HEMTs

Authors
Type
Published Article
Journal
Materials Science in Semiconductor Processing
Publisher
Elsevier
Publication Date
May 23, 2018
Volume
78
Identifiers
DOI: 10.1016/j.mssp.2017.09.028
Source
MyScienceWork
License
Green

Abstract

In this article, we review recent progress on AlGaN/GaN and InAlN/GaN metal-insulator-semiconductor high-electron-mobility transistors (MIS-HEMTs) using Al-based oxides, nitride dielectrics, SiO2 and high-k dielectrics. Although GaN MIS-HEMTs have been suffering from the instability of threshold voltage (VTH), recent interface technologies using in-situ SiNx and surface oxidation of (Al)GaN achieved excellent DC and dynamic performances of GaN MIS-HEMTs with stable VTH. Furthermore, a new design of the gate dielectric such as a nanolaminate structure has been applied to GaN HEMTs. GaN-based MIS-HEMTs sometimes showed sudden current saturation at forward gate bias, and we discuss effects of electronic states at insulator-semiconductor interfaces on current linearity of GaN MIS-HEMTs. Finally, we present effective surface passivation schemes in conjunction with field-plate structures and emerging device structures utilizing multi nanochannels under the gate region.

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