Power Cycling Issues and Challenges of SiC-MOSFET Power Modules in High Temperature Conditions

Authors

• Ibrahim, Ali
• Ousten, Jean-Pierre
• LALLEMAND, Richard
• Khatir, Zoubir

Publication Date

Jan 01, 2016

Source

HAL-UPMC

Keywords

• Reliability
• Composant Electronique
• Module
• Haute Temperature
• Electronique De Puissance
• [Spi.Tron]Engineering Sciences [Physics]/Electronics

Language

English

License

Unknown

External links

• Full record on hal.archives-ouvertes.fr