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Nanoscale Wire Bonding of Individual Ag Nanowires on Au Substrate at Room Temperature

Authors
  • Peng, Peng1, 2
  • Guo, Wei1
  • Zhu, Ying1
  • Liu, Lei3
  • Zou, Guisheng3
  • Zhou, Y. Norman3, 4
  • 1 Beihang University, School of Mechanical Engineering and Automation, Beijing, 100191, People’s Republic of China , Beijing (China)
  • 2 Beihang University, International Research Institute for Multidisciplinary Science, Beijing, 100191, People’s Republic of China , Beijing (China)
  • 3 Tsinghua University, Department of Mechanical Engineering, Beijing, 100084, People’s Republic of China , Beijing (China)
  • 4 University of Waterloo, Centre for Advanced Materials Joining, Waterloo, ON, N2L 3G1, Canada , Waterloo (Canada)
Type
Published Article
Journal
Nano-Micro Letters
Publisher
Springer Berlin Heidelberg
Publication Date
Feb 08, 2017
Volume
9
Issue
3
Identifiers
DOI: 10.1007/s40820-017-0126-8
Source
Springer Nature
Keywords
License
Green

Abstract

AbstractThe controllable wire bonding of individual Ag nanowires onto a Au electrode was achieved at room temperature. The plastic deformation induced by pressure using nanoindentation could break the protective organic shell on the surface of the Ag nanowires and cause atomic contact to promote the diffusion and nanojoining at the Ag and Au interface. Severe slip bands were observed in the Ag nanowires after the deformation. A metallic bond was formed at the interface, with the Ag diffusing into the Au more than the Au diffused into the Ag. This nanoscale wire bonding might present opportunities for nanoscale packaging and nanodevice design.Graphical Abstract

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