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Microstructure and Creep Deformation of Sn-Ag-Cu-Bi/Cu Solder Joints

Authors
  • He, Min1
  • Ekpenuma, Sylvester N.2
  • Acoff, Viola L.1
  • 1 The University of Alabama, Department of Metallurgical and Materials Engineering, Tuscaloosa, AL, 35487-0202, USA , Tuscaloosa (United States)
  • 2 Claflin University, School of Natural Sciences and Mathematics, Orangeburg, SC, 29115, USA , Orangeburg (United States)
Type
Published Article
Journal
Journal of Electronic Materials
Publisher
Springer US
Publication Date
Dec 28, 2007
Volume
37
Issue
3
Pages
300–306
Identifiers
DOI: 10.1007/s11664-007-0368-1
Source
Springer Nature
Keywords
License
Yellow

Abstract

Sn-Ag-Cu solder is one of the candidate alternatives to Sn-Pb-based solders. In order to improve its performance, different materials have been added to Sn-Ag-Cu-based solders. Several studies on Sn-Ag-Cu-based solders with Bi additions have shown Sn-Ag-Cu-Bi to be a class of solders with good wetting behavior and good performance that show great promise for use in the electronics assembly and packaging industry. To investigate the mechanical reliability of the Sn-Ag-Cu-Bi solders further, single-lap shear creep characteristics have been studied in this work. Dog-bone-type solder joint specimens were formed using five types of solder alloys, Sn-3.0Ag-0.5Cu and Sn-3.0 Ag-0.5Cu-xBi (x = 1 wt.% to 4 wt.%) with Cu substrates, and creep tests were performed at temperatures of 120°C and 150°C under stresses of 5 MPa to 10 MPa. Results indicate that the rupture times for Sn-3.0Ag-0.5Cu-xBi solder joints up to 4 wt.% of Bi are longer than the rupture time for Sn-3.0Ag-0.5Cu. Stress exponents ranged from 3 to 7 for temperatures of 150°C and 120°C with stresses under 10 MPa. Microstructural analyses using scanning electron microscopy (SEM) were performed and related to the creep behavior of the solder joints.

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