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SAM meets MEMS: reliable fabrication of stable Au-patterns embedded in PDMS using dry peel-off process

Authors
  • Byun, Ikjoo1
  • Coleman, Anthony W.2
  • Kim, Beomjoon1
  • 1 The University of Tokyo, CIRMM, Institute of Industrial Science, Tokyo, Japan , Tokyo (Japan)
  • 2 LMI, CNRS UMR 5615, Université Lyon 1, Villeurbanne, France , Villeurbanne (France)
Type
Published Article
Journal
Microsystem Technologies
Publisher
Springer-Verlag
Publication Date
Oct 06, 2013
Volume
20
Issue
10-11
Pages
1783–1789
Identifiers
DOI: 10.1007/s00542-013-1923-8
Source
Springer Nature
Keywords
License
Yellow

Abstract

This paper describes a reliable method for fabrication of stable gold patterns embedded in polydimethylsiloxane (PDMS) using a direct peel-off process. Two different surface modifications with self-assembled monolayers were carried out for easy and reliable transfer of Au micro-patterns to the PDMS: (1) perfluorodecyltrichlorosilane on a Si substrate for easy release of the Au patterns from the Si substrate, and (2) (3-mercaptopropyl)trimethoxysilane on the Au patterns to promote the adhesion between the Au patterns and PDMS. Au features as small as 2 μm, in shapes of line and dots, were successfully transferred from the Si substrate to the PDMS over a 3-inch wafer. Transfer of Au patterns to PDMS using the dry peel-off process did not cause any contamination of PDMS, typically seen in wet chemical methods. Finally, the stability of the Au patterns embedded in PDMS was confirmed by the Scotch-tape adhesion test.

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