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The MAPS foil

Authors
  • Beolé, S.
  • Carnesecchi, F.
  • Contin, G.
  • de Oliveira, R.
  • di Mauro, A.
  • Ferry, S.
  • Hillemanns, H.
  • Junique, A.
  • Kluge, A.
  • Lautner, L.
  • Mager, M.
  • Mehl, B.
  • Rebane, K.
  • Reidt, F.
  • Sanna, I.
  • Šuljić, M.
  • Yüncü, A.
Type
Preprint
Publication Date
Oct 19, 2022
Submission Date
May 25, 2022
Identifiers
DOI: 10.1016/j.nima.2022.167673
Source
arXiv
License
Green
External links

Abstract

We present a method of embedding a Monolithic Active Pixel Sensor (MAPS) into a flexible printed circuit board (FPC) and its interconnection by means of through-hole copper plating. The resulting assembly, baptised "MAPS foil", is a flexible, light, protected, and fully integrated detector module. By using widely available printed circuit board manufacturing techniques, the production of these devices can be scaled easily in size and volume, making it a compelling candidate for future large-scale applications. A first series of prototypes that embed the ALPIDE chip has been produced, functionally tested, and shown to be working.

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