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Influência da aplicação de um sistema adesivo na resistência de união entre resinas bulk fill flow e resina nanoparticulada em reparos

  • Castro, Maria José Domingues de
Publication Date
Dec 04, 2018
Repositório Institucional UNESP
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The aim of our paper was to analyse the bonding influence of Adper Scotchbond Multipurpose Adhesive (A) and Heraeus Gluma universal bond (G), or no bond application, on bond strength between microhibrid Filtek Bulk Fill Flow (F) and nanohibrid X-tra base (X) as based composite resin and the conventional nanoparticulate Z350 XT (Z)) as cover. Simulating non-invasive repairs of direct restorations on posterior teeth. A total of 120 specimens were made from flow composite resin in the conical trunk format with the dimensions of 2x4x4, for 40s with Led-5 (N/S LD51803005) at 800mw/cm². Sixty Filtek bulk fill (F) and sixty X-tra base (X) were made. Half of each group (n=30) was aged by thermocycling 5,000 cycles from 5° C to 55° C, (FE, XE), the other half were not subjected to any aging procedure (FN, XN). These specimens were randomly divided into 3 subgroups (n = 10), on the smaller diameter of the 10 samples the Bond of each adhesive system were applied after conditioned by their respectively acids at the time recommended by the manufacturers. The other 10 units of each group did not receive any adhesive system. In the sequency of repair simulation the first two Teflon halves were turned up with the smaller diameter turned upwards. Above this face were placed two other halves in Teflon with the smaller diameter facing down. The Z350 repair composite resin were inserted by incremental technique and photopolymerized for 20s at 800mw/cm². After 24h of storage in distilled water in a bacteriological oven, the now hourglass-shaped specimens were drawn in the universal testing machine EMIC. All the fractured specimens had the type of failure analyzed in stereomicroscope. The most significant faulting specimens were evaluated with electronic microscope (MEV). The data collected at the traction test were analyzed through 3-factor ANOVA and Tukey's test (p <5%). There was a significant difference (p <5%) for the variable adhesive system application for Filtek Bulk Fill flow resin that presented averages (24.99 ± 4.3 MPa) when compared to the group in which no adhesive was applied (18.20 ± 5.31 MPa). The same did not occur with X-tra base resin, in which the adhesive factor did not interfere significantly. When comparing the performance of Filtek Bulk Fill Flow resins and X-tra base (26.99 ± 6.11 MPa) without application of adhesive system, a significant difference was also observed, which did not occur for X-tra base resin when compared both subgroups. Most of the failures were adhesive for all groups. Scanning electron microscopy images do not reveal any traces of discontinuity between the layers of the materials used (resin x resin or resin x adhesive).

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