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An analysis of dimensional and locational variations in surface-mounted component assembly

Authors
Journal
Computer Integrated Manufacturing Systems
0951-5240
Publisher
Elsevier
Publication Date
Volume
11
Issue
3
Identifiers
DOI: 10.1016/s0951-5240(98)00019-6
Disciplines
  • Mathematics

Abstract

Abstract This study focuses on the errors involved in the component fetching and placement phase of pc board assembly with surface-mounted components. Various critical dimensional and locational parameters involved in this phase, which can lead to mis-assembly, are identified. The complex relationships between these parameters, which govern the proper component (pin) placement on the pc board (pad), are mathematically modeled, using both additive and statistical error compounding methods. The use of the model is shown with a quantitative example.

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