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On the toughness of ductile adhesive joints

Authors
Journal
Journal of the Mechanics and Physics of Solids
0022-5096
Publisher
Elsevier
Publication Date
Volume
44
Issue
5
Identifiers
DOI: 10.1016/0022-5096(96)00011-7

Abstract

Abstract Crack propagation along one of the interfaces between a thin ductile adhesive layer and the elastic substrates it joins is considered. The layer is taken as being elastic-plastic, and the fracture process of the interface is modeled by a traction-separation law, characterized by the peak separation stress \ ̂ gs and the work of separation per unit area Γ 0. Crack growth resistance curves for mode I loading of the adhesive joint are computed, with emphasis on steady-state toughness, as a function of three extrinsic effects: layer thickness, layer-substrate modulus mismatch, and initial residual stress in the layer. Conditions under which separation first occurs well ahead of the initial crack tip are discussed.

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