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Effects of solder temperature on pin through-hole during wave soldering: thermal-fluid structure interaction analysis.

Authors
Type
Published Article
Journal
The Scientific World JOURNAL
1537-744X
Publisher
Hindawi (The Scientific World)
Publication Date
Volume
2014
Pages
482363–482363
Identifiers
DOI: 10.1155/2014/482363
PMID: 25225638
Source
Medline

Abstract

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