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Effect of under-layer treatment of Ta/TaN barrier film on corrosion between Cu seed and Ta in chemical-mechanical-polishing slurry.

Authors
Type
Published Article
Journal
Journal of Nanoscience and Nanotechnology
1533-4880
Publisher
American Scientific Publishers
Publication Date
Volume
10
Issue
7
Pages
4196–4203
Identifiers
PMID: 21128400
Source
Medline

Abstract

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