The effect of polyether suppressors on the nucleation and growth of copper on RuTa seeded substrate for direct copper plating

Authors

• Nagar, Magi Margalit
• Radisic, A
• Strubbe, Katrien
• Vereecken, PM

Publication Date

Jan 01, 2014

Source

Ghent University Institutional Archive

Keywords

• Chemistry
• Copper Electrodeposition
• Nucleation And Growth
• Direct Plating
• Damascene Process
• Polyether Suppressors
• Electrochemical Deposition
• Diffusion Barrier
• Cu Interconnects
• Glycol
• Electrodeposition
• Chloride
• Metallization
• Inhibition
• Adsorption
• Additives

Language

English

License

Unknown

External links

• Full record on biblio.ugent.be
  
• Full record on doi.org
  
• Full record on biblio.ugent.be