Affordable Access

Publisher Website

Effects of TMF heating rates on damage accumulation and resultant mechanical behavior of Sn–Ag based solder joints

Authors
Journal
Microelectronics Reliability
0026-2714
Publisher
Elsevier
Publication Date
Volume
47
Issue
1
Identifiers
DOI: 10.1016/j.microrel.2006.02.001

Abstract

Abstract Solder joint reliability depends on several service parameters such as temperature extremes encountered, dwell times at these temperatures, and the ramp-rates representing the rate at which the temperature changes are imposed. TMF of Sn–Ag based solder alloy joints of realistic dimensions were carried out with dwell of 115 min and 20 min at 150 °C and −15 °C, respectively. Different heating rates were obtained by controlling the power input during heating part of TMF cycles. Surface damage and residual mechanical strength of these solder joints were characterized after 0, 250, 500, and 1000 TMF cycles to evaluate the role of TMF heating rate on the solder joint integrity.

There are no comments yet on this publication. Be the first to share your thoughts.