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Spontaneous growth of whiskers from electrodeposited coatings

Authors
Journal
Journal of Crystal Growth
0022-0248
Publisher
Elsevier
Publication Date
Volume
10
Issue
1
Identifiers
DOI: 10.1016/0022-0248(71)90049-2

Abstract

Abstract The whisker growth from electrodeposited tin was investigated. The inclusion of foreign metal atoms and the existence of internal stresses in the coating were shown to be the factors which lead to the growth of whiskers. The thermal treatment of the deposits and the action of ultrasonic waves prevent whisker growth. The mechanism of internal stress relaxation in connection with growth is discussed.

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