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Interface interactions relevant to packaging technology

Authors
Journal
Thin Solid Films
0040-6090
Publisher
Elsevier
Publication Date
Volume
166
Identifiers
DOI: 10.1016/0040-6090(88)90370-7
Disciplines
  • Chemistry
  • Physics

Abstract

Abstract Interfaces play increasingly important roles in modern electronic technologies, including devices, interconnects and packaging, which use materials in thin film form extensively. Interactions at different interfaces therefore have a significant impact on the reliability and performance of the parts fabricated, as well as on the choice of the processes and structures. Two types of interactions, chemical and mechanical, are described here for several systems, including metal/metal, metal/ semiconductor, metal/polymer and metal/superconducting oxide. The application of such an understanding to packaging technology is also discussed.

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