Affordable Access

Publisher Website

Problems of PCB microvias filling by conductive paste

Authors
Journal
Microelectronics Reliability
0026-2714
Publisher
Elsevier
Publication Date
Volume
47
Identifiers
DOI: 10.1016/j.microrel.2006.02.018
Disciplines
  • Chemistry

Abstract

Abstract The using of conductive paste for the through holes and the blind holes filling in PCBs were analyzed. Such processes seem to be easy and can be applied instead of common used electrochemical plating process. The performed investigations have shown that these processes are not so simple. To understand more problems connected with microvias filling, the influence of adhesive rheology and printing parameters for the quality of small diameter through holes filling and small diameter blind vias were investigated. The performed analysis was supplemented by electrical measurements as well as observation of microvia cross sections. The FR-4 laminate test samples with through holes with 0.3, 0.5 and 0.8 mm diameters as well as blind holes diameters 0.15, 0.3 and 0.45 mm were used in experiments. The average single fills resistances in the range 50 mΩ for through hole fillings diameter 0.5 mm and below 20 mΩ for blind holes diameter 0.3 mm was obtained. The adhesive fill resistance is stable after dump heat and thermal cycling tests.

There are no comments yet on this publication. Be the first to share your thoughts.

Statistics

Seen <100 times
0 Comments

More articles like this

[PCB].

on Nihon eiseigaku zasshi. Japane... April 1974

[A clinical study on iodoform and oxide eugenol pa...

on Shanghai kou qiang yi xue = Sh... December 2000

[Evaluation of Endomethasone paste as a root canal...

on Czasopismo stomatologiczne November 1975
More articles like this..