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Ultrasonic Ball/Wedge Bonding of Aluminium Wires

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ElectroComponent Science and Technology
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Abstract

The process of ball/wedge bonding and its advantages are described. A capacitor discharge technique for the formation of balls on 25 and 75 μm diameter aluminium wires is discussed. Ultrasonic welding trials were carried out and the bonds subjected to pull tests with good results. Bonds of good strength were made between 25 μm diameter Al-1% Si wire and Al thin films, Pd-Au thick films and Au flashed Kovar.

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