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Design and Manufacturing of a Double-Side Cooled, SiC based, High Temperature Inverter Leg

Authors
  • Riva, Raphaël
  • Buttay, Cyril
  • Locatelli, Marie-Laure
  • Bley, V.
  • ALLARD, Bruno
Publication Date
May 13, 2014
Source
HAL-UPMC
Keywords
Language
English
License
Unknown
External links

Abstract

In this paper, we present a small (25x25x3 mm 3 ) power module that integrates two silicon-carbide (SiC) JFETs to form an inverter leg. This module has a sandwich" structure, i.e. the power devices are placed between two ceramic substrates, allowing for heat extraction from both sides of the dies. All interconnects are made by silver sintering, which offers a very high temperature capability (the melting point of pure silver being 961 °C). The risk of silver migration is assessed, and we show that Parylene-HT, a dielectric material that can sustain more than 300 °C, can completely coat the module, providing adequate protection.

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