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Relationship between nature of metal-oxide contacts and resistive switching properties of copper oxide thin film based devices

Authors
Journal
Thin Solid Films
0040-6090
Publisher
Elsevier
Publication Date
Identifiers
DOI: 10.1016/j.tsf.2014.08.030
Keywords
  • Copper Oxide
  • Unipolar Resistive Switching
  • Rf Sputtering
  • Metal-Oxide Contact
  • Schottky Contact
  • Ohmic Contact

Abstract

Abstract The current-voltage and resistive switching properties of Cu2O and CuO based resistive random access memories in metal-oxide-metal structure with Cu as bottom electrode and different metals (Ti, Ag, Au and Pd) as top electrodes have been investigated. The observation of resistive switching in Cu2O and its absence in CuO based devices indicates that Ohmic nature of top and bottom metal–oxide contacts is favourable for resistive switching behaviour. The rectifying metal-oxide contact results in the applied voltage drop at the rectifying contact, resulting in the absence of electric field induced structural changes which are crucial for occurrence of resistive switching. The values of switching parameters, such as, electroforming, reset, set voltages and also the resistance ratio are also observed to depend upon the work function of the electrode materials and nature of metal-oxide interface.

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