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SMD Reflow Soldering: A Thermal Process Model

Authors
Journal
CIRP Annals - Manufacturing Technology
0007-8506
Publisher
Elsevier
Publication Date
Volume
40
Issue
1
Identifiers
DOI: 10.1016/s0007-8506(07)61925-8
Keywords
  • Assembly
  • Electronics
  • Soldering
Disciplines
  • Design

Abstract

Summary This paper presents a number of numerical process models of the infra-red reflow soldering process, the major joining process for surface mount assemblies. The aim of this work is to investigate the key process and design variables and their effect on joint quality in the final assembly. The paper includes models of a bare printed circuit board and “J” and “Gull-Wing” leaded components on a printed circuit board all passing through an infra-red oven. The process models are based and I-DEAS modeling suite and TMG thermal solver and are likely to find application in process design.

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