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The influence of shaping process on microstructure and properties of BaTiO3-based chip thermistors

Authors
Journal
Ceramics International
0272-8842
Publisher
Elsevier
Publication Date
Volume
32
Issue
7
Identifiers
DOI: 10.1016/j.ceramint.2005.05.021
Keywords
  • C. Electrical Properties
  • Shaping Process
  • Microstructure
  • Chip Thermistors

Abstract

Abstract BaTiO 3-based chip ceramics with a thickness of 0.3 mm were prepared by three different forming techniques: gelcasting, slipcasting and roll-forming. The resistance–temperature and voltage–current characteristics of the obtained chip ceramics were studied. The influence of forming process on microstructures of green sheets and ceramic bodies was also analyzed in detail. The results indicate that gelcast and slipcast ceramics possessing more uniform microstructure exhibit stronger PTC (positive temperature coefficient) effect and higher withstand voltage than roll-formed ones.

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