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Instrumentation to measure thermal contact resistance

IOP Publishing Ltd
Publication Date
  • Instrumentation And Applied Physics (Formally Isu)


Instrumentation was developed to measure the thermal contact resistance across metallic contacts by varying the contact pressure in different environments. Experiments were conducted on oxygen free, high conductivity (OFHC) copper cylindrical flat contacts and the measured thermal contact resistance is in good agreement with the theoretical models reported in the literature. The thermal conductivity of OFHC copper and stainless steel was measured at different temperatures and these values are in good agreement with the literature values.

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