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Crack control in GaN grown on silicon (111) using In doped low-temperature AlGaN interlayer by metalorganic chemical vapor deposition

Authors
  • jiejun), (wu
  • xiuxun), xx han (han
  • jiemin), (li
  • hongyuan), hy wei (wei
  • guangwei), gw cong (cong
  • xianglin), xl liu (liu
  • qinsheng), qs zhu (zhu
  • zhanguo), zg wang (wang
  • quanjie), qj jia (jia
  • liping), lp guo (guo
  • tiandou), (hu
  • huanhua), hh wang (wang
Publication Date
Jan 01, 2006
Source
Knowledge Repository of SEMI,CAS
Keywords
License
Unknown
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Abstract

The effects of In doped low-temperature (LT) AlGaN interlayer on the properties of GaN/Si(111) by MOCVD have been investigated. Using In doping LT-interlayer can decrease the stress sufficiently for avoiding crack formation in a thick (2.0 mu m) GaN layer. Significant improvement in the crystal and optical properties of GaN layer is also achieved. In doping is observed to reduce the stress in AlGaN interlayer measured by high-resolution X-ray diffraction (HRXRD). It can provide more compressive stress to counteract tensile stress and reduce crack density in subsequent GaN layer. Moreover, as a surfactant, indium is observed to cause an enhanced PL intensity and the narrowed linewidths of PL and XRD spectra for the LT-interlayer. Additionally, the crystal quality of GaN layer is found to be dependent on the growth parameters of underneath In-doped LT-AlGaN interlayer. The optimal parameters, such as TMIn flow rate, TMAl flow rates and thickness, are achieved to obtain nearly 2.0 mu m thick crack free GaN film with advanced optical and crystal properties. (c) 2005 Elsevier B.V. All rights reserved.

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