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Physical vapor deposition (PVD) processes

Authors
Journal
Metal Finishing
0026-0576
Publisher
Elsevier
Publication Date
Volume
97
Issue
1
Identifiers
DOI: 10.1016/s0026-0576(99)80043-9
Disciplines
  • Economics

Abstract

Summary Each of the PVD processes discussed has its advantages and disadvantages. Each requires different process monitoring and controlling techniques. Generally, the most simple technique and configuration that will give the desired film properties and most economical product throughput should be used.

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