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A one-step process to engineer superhydrophobic copper surfaces

Authors
Publisher
Elsevier B.V.
Publication Date
Volume
64
Issue
24
Identifiers
DOI: 10.1016/j.matlet.2010.09.010
Keywords
  • One-Step Process
  • Superhydrophobicity
  • Copper Surface
  • Water Contact Angle
  • Scanning Electron Microscopy
  • X-Ray Diffraction

Abstract

Abstract Superhydrophobic surfaces are conventionally prepared employing two steps: roughening a surface and lowering their surface energy. In the present work, a direct voltage (DC) is applied between two copper plates immersed in a dilute ethanolic stearic acid solution. The surface of the anodic copper electrode transforms to superhydrophobic due to a reaction between copper and stearic acid solution. The fabrication process of superhydrophobic copper surfaces is simplified in just one-step. The surface of the anodic copper is found to be covered with flower-like low surface energy copper stearate films providing the water contact angle of 153 ± 2° with the roll-off properties.

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