A new type of 3-D sensor has been developed using double sided processing with the aim of simplifying the production process. The results of strip and pixel devices from the first production run are presented. The devices fully deplete at 8 V. Tests on a beamline at the Diamond Synchrotron demonstrate much reduced charge sharing in the 3-D devices compared to planar devices. 3-D sensors also potentially have application in the harsh radiation environment of the LHC experiment upgrades. The optimal spacing between electrodes for this application has been simulated, and a cell dimension of 50-100 µm found to be optimal. The work is placed in the context of other types of 3-D architecture detectors and the work of other groups on the commercial fabrication of devices is briefly reported.