Publisher Summary The placement of surface-mounted devices (SMDs) is simple, and pick and place machines can handle a variety of components than insertion machines for leaded components. There are two strategies of component placement: the manual and semi-automatic manual methods and the fully automatic ones, which also fall into two categories: the sequential and the simultaneous systems. The evolution of the SMDs is one of the driving forces behind the development of automatic placement equipment. A mandatory requirement for placement machines is robust construction, which resembles a machine tool rather than that of a piece of office equipment, which needs frequent attention. The importance of a high placement speed depends on whether the machine is a part of a high-output assembly line and soldering a limited number of types of board. The main needs for most users are the ease and storability of programming, a wide range of components, which the machine can handle, and the speed of changeover from one placement program to another. The different classes of placement machines are: entry level and mid range machines, fine-pitch placement machines, high-speed chip shooters, and very high-speed placement machines.