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Initial stages of copper electrodeposition in the presence of organic additives

Authors
Journal
Electrochimica Acta
0013-4686
Publisher
Elsevier
Publication Date
Volume
38
Issue
16
Identifiers
DOI: 10.1016/0013-4686(93)85116-g
Keywords
  • Electrodeposition
  • Nucleation And Growth Kinetics
  • Organic Additives
  • Copper Plating
Disciplines
  • Chemistry

Abstract

Abstract The nucleation and growth kinetics of copper crystals electrochemically deposited on platinum and tungsten have been studied in the presence of a composite organic additive for bright copper plating. Data were obtained for the exchange current density i 0, for the transition coefficient α of the copper ions, for the stationary nucleation rate I st and for the size n k of the critical copper nucleus.

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