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A chemical polish method for the preparation of silicon substrates for epitaxial deposition

Authors
Journal
Microelectronics Reliability
0026-2714
Publisher
Elsevier
Publication Date
Volume
5
Issue
1
Identifiers
DOI: 10.1016/0026-2714(66)90005-9
Disciplines
  • Chemistry

Abstract

Abstract In preparing silicon epitaxial substrates for experimental purposes or for applications where planarity of the layer is not important it is convenient to use a chemical rather than a mechanical polish. A chemical polishing method is described and full process details are given. The microfinish of the chemically polished substrates was examined by various techniques and was shown to be not inferior in quality to that of available mechanically polished substrates.

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