Affordable Access

Publisher Website

The evaluation of heat conduction via an electrical analog

Authors
Journal
Cryogenics
0011-2275
Publisher
Elsevier
Publication Date
Volume
17
Issue
4
Identifiers
DOI: 10.1016/0011-2275(77)90168-0
Disciplines
  • Design

Abstract

Abstract The heat conduction through an object of arbitrary shape whose thermal conductivity is a known function of temperature can be calculated from the electrical resistance of an identically shaped object. This eliminates the need for tedious low temperature heat conduction measurements or computer calculations during design stages. Even in cases where an intermediate temperature heat shield is used (as on a mechanical dewer support) the electrical analog is applicable.

There are no comments yet on this publication. Be the first to share your thoughts.