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Solder transfer of carbon nanotube microfin coolers to ceramic chips

Authors
Journal
Applied Thermal Engineering
1359-4311
Publisher
Elsevier
Volume
65
Identifiers
DOI: 10.1016/j.applthermaleng.2014.01.056
Keywords
  • Solder Transfer
  • Aligned Carbon Nanotubes
  • Ceramic Chip
  • Cooling

Abstract

Abstract In this study, vertically aligned multi-walled carbon nanotubes are used as integrated microfin cooler structures on ceramic chips. The nanotube films are soldered on alumina test chips, which offer a fast, efficient and up-scalable transfer method. Metal coating on the tips of nanotubes is applied to improve solder wettability, adhesion, and to improve thermal interface between the cooler and the chip. The cooling performance of the carbon nanotubes based assemblies is comparable with their counterparts having copper-based coolers. The concept presented here shows the feasibility of CNT integration into ceramic electrical components and packages with the potential of large-scale production.

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