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Electronic structure and bonding of the Cu/W(001) surface alloy

Authors
Journal
Surface Science
0039-6028
Publisher
Elsevier
Publication Date
Volume
216
Identifiers
DOI: 10.1016/0039-6028(89)90659-6

Abstract

Abstract Results of ab initio electronic structure calculations for the recently reported Cu/W(001) surface alloy are reported. The results demonstrate that there are no strong bonding effects between Cu and W atoms in this alloy but rather that it is formed because the W(001) surface has a near-instability against the formation of surface vacancies.

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