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The kinetics and mechanism of the low temperature corrosion of titanium with copper(I) chloride. A comparison with silicon and an SiTi alloy

Authors
Journal
Journal of Alloys and Compounds
0925-8388
Publisher
Elsevier
Publication Date
Volume
184
Issue
2
Identifiers
DOI: 10.1016/0925-8388(92)90495-u
Disciplines
  • Earth Science

Abstract

Abstract Kinetics analysis of the thermogravimetric curves obtained for the corrosion of titanium or TiSi 2 with copper(I) chloride(CuCl) in the temperature range 240–290 °C revealed that the isothermal reaction is governed by a nucleation-growth mechanism with an apparent activation energy of 207 kJ mol −1 for the Ti/CuCl and 153 kJ mol −1 for the TiSi 2/CuCl system. In both cases X-ray diffraction analysis indicated the formation of only copper during the course of the reaction, in contrast to Me/CuCl systems (Me ≡ Si, Ge) where MeCu χ compounds are also identified as intermediate reaction products.

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