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Steady motion of an insulating rigid flat-ended punch over a thermally conducting half-plane

Authors
Journal
Wear
0043-1648
Publisher
Elsevier
Publication Date
Volume
102
Identifiers
DOI: 10.1016/0043-1648(85)90087-0

Abstract

Abstract An insulated, rigid, flat-ended punch moving steadily over the surface of a half-plane is considered. It is assumed that the motion has been sustained for a sufficiently long period for a steady thermal state to have been achieved, the source of heat being the energy dissipated at the interface due to Coulomb friction. The effect of thermal distortion on the contact pressure distribution is found and the temperature profile under the punch is given. A closed-form solution is found for the case of large Peclet number.

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