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Direct bonding in patent literature

Authors
Journal
Philips Journal of Research
0165-5817
Publisher
Elsevier
Publication Date
Volume
49
Identifiers
DOI: 10.1016/0165-5817(95)82009-4
Keywords
  • Direct Bonding
  • Patent Literature

Abstract

Abstract Patent literature tells its own story of technological innovations. This story is evaluated here in the case of direct bonding. It is concluded that, on a worldwide basis, direct bonding has been approached via three avenues: optical, silicon technology and silicon wafer preparation.

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