Affordable Access

Publisher Website

Sub-quarter micron silicon integrated circuits and single wafer processing

Authors
Journal
Microelectronics Reliability
0026-2714
Publisher
Elsevier
Publication Date
Volume
38
Issue
9
Identifiers
DOI: 10.1016/s0026-2714(98)00052-3
Disciplines
  • Physics

Abstract

Abstract This paper describes the role of single wafer processing in the development of sub-quarter micron silicon integrated circuits (ICs). The issues related to device processing, choice of materials, performance, reliability, and manufacturing are covered. Single wafer processing based rapid photothermal processing (dominant photons with wavelength less than about 800 nm) is an ideal answer to almost all the thermal processing requirements of current and future Si ICs. For process integration, a new model for process optimization based on minimization of thermal stress is proposed. For breaking the sub-100 nm manufacturing barriers, high throughput lithography based on direct writing is a proposed solution.

There are no comments yet on this publication. Be the first to share your thoughts.