Affordable Access

Publisher Website

Enhanced growth of the Ni3Sn4phase at the Sn/Ni interface subjected to strains

Authors
Journal
Scripta Materialia
1359-6462
Publisher
Elsevier
Publication Date
Volume
65
Issue
8
Identifiers
DOI: 10.1016/j.scriptamat.2011.07.007
Keywords
  • Intermetallic Compounds
  • Nickel
  • Grain Growth
  • Strain

Abstract

A Sn/Ni bilayer deposited on a Si substrate is subjected to tensile or compressive strain under three-point bending to investigate the Sn/Ni interfacial reactions under strain. Both tensile and compressive strains are found to have enhanced effects on the growth of the Ni 3Sn 4 phase which formed at the Sn/Ni interface when it was aged at 200 °C. When subjected to strains, the Ni layer exhibits significant microstructure evolution, which is suggested to play a crucial role in the enhanced growth of the Ni 3Sn 4 phase.

There are no comments yet on this publication. Be the first to share your thoughts.

Statistics

Seen <100 times
0 Comments

More articles like this

Thermal-gradient induced abnormal Ni3Sn4interfacia...

on Journal of Alloys and Compound... Dec 15, 2013

Growth kinetics of Ni3Sn4and Ni3P layer between Sn...

on Journal of Alloys and Compound... Jan 01, 2004

The Ni3Sn4intermetallic as a novel electrode in li...

on Journal of Power Sources Jan 01, 2005
More articles like this..