Affordable Access

Publisher Website

Nanohardness of copper in the vicinity of grain boundaries

Authors
Journal
Scripta Materialia
1359-6462
Publisher
Elsevier
Publication Date
Volume
47
Issue
12
Identifiers
DOI: 10.1016/s1359-6462(02)00284-1
Keywords
  • Nanoindentation
  • Grain Boundaries
  • Dislocations

Abstract

Abstract The nanohardness in the vicinity of grain boundaries in high purity Cu was investigated. It was found that the nanohardness increases while approaching the grain boundary, the characteristic distance at which the grain boundary influences the nanohardness being in the range of few micrometers.

There are no comments yet on this publication. Be the first to share your thoughts.