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Preliminary assessment of the stability of thin- and polymer thick-film resistors embedded into printed wiring boards

Authors
Journal
Microelectronics Reliability
0026-2714
Publisher
Elsevier
Volume
52
Issue
8
Identifiers
DOI: 10.1016/j.microrel.2012.03.026

Abstract

Abstract Embedding passive components into multilayer printed wiring boards (PWBs) meet electronic device requirements concerning the necessity of saving the surface board area for active elements, reducing board’s size, improving device functionality and safety as well as overall product cost reduction. Since embedded components cannot be replaced after the board is completed, a long term stability and reliability are the important concerns for manufactures. This paper presents the results of examinations of embedded thin-film NiP resistors and polymer thick-film resistors during their continuous operation and the influence of temperature on the resistance values after the simulation of a lead-free soldering process and after the temperature cycling test (−40˚C/+85˚C).

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