NOVELTY - A silicon transducer chip (1) has parallel backplate and movable diaphragm (12) and forms an electrical capacitor. The chip and electronic circuit chip (3) are provided on either sides of intermediate chip (2). The chip (2) has openings (4,10) between two sides of the chip, to allow sound towards diaphragm. Surface of the chip (2) has electrical conductors (14) to connect chip with IC chip (3). USE - For use in miniature electroacoustic devices such as hearing aid. ADVANTAGE - Since sound inlet is covered by filter, dust, moisture and other impurities do not obstruct interior and sound inlet of microphone. External electrical connection can be made economically reliable and the thermal stress is avoided with the small size solid state silicon based condenser microphone.