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Laser Sealed Packaging for Microsystems

IFIP International Federation for Information Processing
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Packaging is the last process of microsystem manufacturing. There are mainly two kinds of packages: plastic or metallic. The two main components of the package (base and cover) may either be glued or soldered. Each of these techniques has its advantages and drawbacks, and the choice should be driven by the functionality of the microsystem. Full Text at Springer, may require registration or fee

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