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Polymer thick film systems and surface mount techniques

Authors
Journal
Microelectronics Journal
0026-2692
Publisher
Elsevier
Publication Date
Volume
18
Issue
3
Identifiers
DOI: 10.1016/s0026-2692(87)80426-3

Abstract

“Addition of surface mounting components to a thick film circuit produces a hybrid. The substrate may be either thick or thin film and with or without passive components already deposited on it” … K.E. Pitt 1. The production of hybrid circuits using thick film pastes based on ceramic and glass binder systems with printed resistors and surface mounted components is well established. The extension of surface mount technologies to the printed circuit board (subtractive process) industries is well under way. New components for surface mounting and new processes for joining these components to circuits are developing. This paper is concerned with innovation in the area of film circuits for hybrid circuit manufacture. Polymer thick films are evaluated in terms of their performance, and also the feasibility of surface mounting components onto polymer thick film circuits to produce hybrids.

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