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Properties of ultrathin silver layers deposited on the Cu(001) face

Authors
Journal
Vacuum
0042-207X
Publisher
Elsevier
Publication Date
Volume
47
Issue
5
Identifiers
DOI: 10.1016/0042-207x(95)00240-5

Abstract

Abstract This work is a continuation of investigations of the Ag Cu (111) and the Ag Cu (011) adsorption systems. The investigations of the Ag Cu (001) interface were performed with AES, LEED, Directional Auger Electron Spectroscopy (DAES) and Directional Elastic Peak Electron Spectroscopy (DEPES). During silver evaporation at the substrate temperature from 300 K up to 440 K the Ag MNN (360eV) and Cu M 2,3VV (62eV) Auger peak kinetics indicate the Stranski-Krastanov growth mechanism. For T = 540 and 700 K the adsorption kinetics show that after 1 ML layer deposition Auger signals from silver h Ag and copper h Cu remain unchanged due to the silver dissolution in the Cu substrate. For T = 820 K a silver dissolution is so fast that coverage of 1 ML was not reached. During annealing of the 2.2 ML of Ag at T = 790 K and 820 K the equilibrium coverage of 1 ML layer is observed, which was predicted by theoretically calculated dissolution isotherms. DEPES profiles for the Cu(001) face clean and covered with 8 ML layers of Ag indicate that the silver layer is composed of (111) islands with three orientations: [112̄(111)Ag∥ [110](001)Cu, [112̄](111)Ag∥ [1̄10](001)Cu, and [21̄1̄](111)Ag ∥ [1̄10](001)Cu.

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