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Preparation of ductile AlGe soldering foils by PFC technique

Authors
Journal
Materials Science and Engineering A
0921-5093
Publisher
Elsevier
Publication Date
Volume
133
Identifiers
DOI: 10.1016/0921-5093(91)90175-m

Abstract

Abstract Ductile ribbons in the thickness range of 28–40 μm can be produced with the PFC process and subsequent annealing. The solder of composition Al 77Ge 23 shows optimum properties relating to manufacturing and soldering at 450°C. The soldering experiments with silicon-chips and metallic supporting substrates show that the soldering joints are equivalent to those produced with gold or AuSi solders. Soldering demands neither soldering flux nor inert gas. The economy of the solder follows from the substitution of gold as well as from the low density of AlGe (one fifth that of gold) which enables many times more soldering joints to be produced with the same mass of solder.

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