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Modelling and analyzing the thermal effect on wafer lenses

Authors
Publisher
Technische Universiteit Eindhoven
Publication Date
Disciplines
  • Physics

Abstract

MODELLING AND ANALYZING THE THERMAL EFFECT ON WAFER LENSES By Esubalew Alemayehu Demissie SUBMITTED IN PARTIAL FULFILLMENT OF THE REQUIREMENTS FOR THE DEGREE OF MASTER OF SCIENCE AT EINDHOVEN UNIVERSITY EINDHOVEN, THE NETHERLANDS AUGUST 2010 Supervisors: Prof.Dr. Mattheij, R.M.M. Dr.ir. Anthonissen, M.J.H. Dr.ir. Brok, J.M. Edwin Wolterink EINDHOVEN UNIVERSITY DEPARTMENT OF INDUSTRIAL AND APPLIED MATHEMATICS The undersigned hereby certify that they have read and recommend to the Faculty of Graduate Studies for acceptance a thesis entitled “Modelling and analyzing the thermal effect on wafer lenses” by Esubalew Alemayehu Demissie in partial fulfillment of the requirements for the degree of Master of Science. Dated: August 2010 External Examiner: Research Supervisor: Examing Committee: ii EINDHOVEN UNIVERSITY Date: August 2010 Author: Esubalew Alemayehu Demissie Title: Modelling and analyzing the thermal effect on wafer lenses Department: Industrial and Applied Mathematics Degree: M.Sc. Convocation: August Year: 2010 Signature of Author iv Not I But Jesus v Table of Contents Table of Contents vi List of Tables viii List of Figures ix Nomenclature xi Abstract xiii Acknowledgements xiv 1 Introduction 1 1.1 Background . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.2 The wafer lens . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 1.2.1 Shape of the lens . . . . . . . . . . . . . . . . . . . . . . . . . 4 1.2.2 Production of lenses . . . . . . . . . . . . . . . . . . . . . . . 4 1.2.3 Thermal effects . . . . . . . . . . . . . . . . . . . . . . . . . . 6 1.3 The software environment . . . . . . . . . . . . . . . . . . . . . . . . 7 1.4 Outline of the thesis . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2 Theory of elasticity and thermoelastic equations 9 2.1 Fundamentals of continuum mechanics . . . . . . . . . . . . . . . . . 9 2.2

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